Micro-Parallel Seam Joining and development of joining equipment. 2nd Report. Surface temperature of ceramic package and seam joining condition.
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
سال: 1987
ISSN: 0288-4771
DOI: 10.2207/qjjws.5.211